Patent Assignment
Reel/Frame 045605/0470
Assignment of Assignor's Interest
Recorded: 2018-04-22
Pages: 7
Assignors
KUO, TSUNG-SHENG
Executed: 2018-02-01
CHU, YANG-ANN
Executed: 2018-02-05
YANG, ALAN
Executed: 2018-02-01
HUANG, VIC
Executed: 2018-02-01
LIU, HSU-CHIU
Executed: 2018-02-08
PAI, JIUN-RONG
Executed: 2018-02-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6, HSINCHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Apparatus and Method for Handling Wafer Carrier Doors