Patent Assignment
Reel/Frame 045616/0204
Assignment of Assignor's Interest
Recorded: 2018-04-24
Pages: 7
Assignors
LEE, JANG-HEE
Executed: 2018-03-20
OH, SE-RAN
Executed: 2018-03-19
KIM, HYUN-SU
Executed: 2018-03-19
KIM, IK-SOO
Executed: 2018-03-19
PARK, SEONG-GIL
Executed: 2018-03-20
JEONG, GEUN-O
Executed: 2018-03-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Metal Hardmask and Semiconductor Device