Patent Assignment
Reel/Frame 045625/0233
Assignment of Assignor's Interest
Recorded: 2018-04-24
Pages: 3
Assignors
HOSHI, YOUSUKE
Executed: 2010-08-20
RYUZAKI, DAISUKE
Executed: 2010-08-26
KOYAMA, NAOYUKI
Executed: 2010-08-30
NOBE, SHIGERU
Executed: 2010-08-11
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2 MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Polishing Agent and Method for Polishing Substrate Using the Polishing Agent
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →