IP Library › Assignment 045656/0958
Patent Assignment
Reel/Frame 045656/0958

Assignment of Assignor's Interest

Recorded: 2018-04-27 Pages: 3
Assignors
LIAO, WEN-SHIANG
Executed: 2018-04-20
CHEN, HUAN-NENG
Executed: 2018-04-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property (1)
Semiconductor Package Device with Integrated Inductor and Manufacturing Method Thereof
Application: 15/964,881 →
Publication: US 2019/0333875
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Assignment Document Previously Recorded on Reel 045656 Frame 0958. Assignor(S) Hereby Confirms the Assignment. May 1, 2018
From: LIAO, WEN-SHIANG; CHEN, HUAN-NENG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
Reel/Frame 046046/0717 →