Patent Assignment
Reel/Frame 046046/0717
Corrective Assignment to Correct the Assignment Document Previously Recorded on Reel 045656 Frame 0958. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2018-05-01
Pages: 5
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Package Device with Integrated Inductor and Manufacturing Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.