Patent Assignment
Reel/Frame 045659/0256
Assignment of Assignor's Interest
Recorded: 2018-04-27
Pages: 4
Assignors
CHEN, WINNIE VICTORIA WEI-NING
Executed: 2018-04-16
HSIAO, MENG-HSUAN
Executed: 2018-04-16
LEE, TUNG-YING
Executed: 2018-04-16
TSAI, PANG-YEN
Executed: 2018-04-15
OKUNO, YASUTOSHI
Executed: 2018-04-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof