Patent Assignment
Reel/Frame 045663/0534
Assignment of Assignor's Interest
Recorded: 2018-04-29
Pages: 16
Assignors
FENG, LI-WEI
Executed: 2018-04-25
TZOU, SHIH-FANG
Executed: 2018-04-25
HO, CHIEN-TING
Executed: 2018-04-25
WANG, YING-CHIAO
Executed: 2018-04-25
CHEN, YU-CHING
Executed: 2018-04-25
CHUANG, HUI-LING
Executed: 2018-04-25
YU, KUEI-HSUAN
Executed: 2018-04-25
Assignees
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
FUJIAN JINHUA INTEGRATED CIRCUIT CO., LTD.
NO.88, LIANHUA AVENUE, INTEGRATED CIRCUIT SCIENCE PARK, JINJIANG CITY, QUANZHOU CITY, FUJIAN PROVINCE, CHINA
Covered Property
(1)
Semiconductor Structure with Capacitor Landing Pad and Method of Making the Same