Patent Assignment
Reel/Frame 045663/0616
Assignment of Assignor's Interest
Recorded: 2018-04-30
Pages: 5
Assignors
LEE, TZUNG-HUI
Executed: 2018-04-03
YU, CHEN-HUA
Executed: 2018-04-16
TSAI, CHI-MING
Executed: 2018-04-03
KUO, HUNG-JUI
Executed: 2018-04-03
HO, MING-CHE
Executed: 2018-04-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Fan-Out Packages and Methods of Forming the Same