Patent Assignment
Reel/Frame 045666/0594
Assignment of Assignor's Interest
Recorded: 2018-04-30
Pages: 5
Assignors
CHEN, PIN-WEN
Executed: 2018-04-18
LAI, CHIA-HAN
Executed: 2018-04-18
CHANG, CHIH-WEI
Executed: 2018-04-18
FU, MEI-HUI
Executed: 2018-04-18
TSAI, MING-HSING
Executed: 2018-04-20
LIN, WEI-JUNG
Executed: 2018-04-18
WANG, YU SHIH
Executed: 2018-04-18
CHENG, YA-YI
Executed: 2018-04-23
CHEN, I-LI
Executed: 2018-04-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Conductive Feature Formation and Structure Using Bottom-Up Filling Deposition