Patent Assignment
Reel/Frame 045671/0751
Assignment of Assignor's Interest
Recorded: 2018-04-30
Pages: 8
Assignors
MIYAMOTO, HIRONOBU
Executed: 2017-12-20
NAKAYAMA, TATSUO
Executed: 2017-12-20
OKAMOTO, YASUHIRO
Executed: 2017-12-20
TSUBOI, ATSUSHI
Executed: 2017-12-07
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device and the Semiconductor Device