Patent Assignment
Reel/Frame 045750/0689
Assignment of Assignor's Interest
Recorded: 2018-05-09
Pages: 2
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Semiconductor Device Including a Pad and a Wiring Line Arranged for Bringing a Probe into Contact with the Pad and Method of Manufacturing the Same