Patent Assignment
Reel/Frame 045759/0092
Assignment of Assignor's Interest
Recorded: 2018-05-09
Pages: 12
Assignors
FENG, LI-WEI
Executed: 2018-05-03
WANG, YING-CHIAO
Executed: 2018-05-03
LIU, TZU-TSEN
Executed: 2018-05-03
TSAI, TSUNG-YING
Executed: 2018-05-03
HO, CHIEN-TING
Executed: 2018-05-03
Assignees
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
FUJIAN JINHUA INTEGRATED CIRCUIT CO., LTD.
NO.88, LIANHUA AVENUE, INTEGRATED CIRCUIT SCIENCE PARK, JINJIANG CITY, QUANZHOU CITY, FUJIAN PROVINCE, CHINA
Covered Property
(1)
Semiconductor Device Having Capped Air Caps Between Buried Bit Lines and Buried Gate