Semiconductor device having capped air caps between buried bit lines and buried gate
A semiconductor device and method of forming the same, the semiconductor device includes plural bit lines, plural conductive patterns, plural conductive pads and a spacer. The bit lines are disposed on a substrate, along a first direction. The conductive patterns are disposed on the substrate, along the first direction, wherein the conductive patterns and the bit lines are alternately arranged in a second direction perpendicular to the first direction. The conductive pads are arranged in an array and disposed over the conductive patterns and the bit lines. The spacer is disposed between the bit lines and the conductive patterns, under the conductive pads, wherein the spacers includes a tri-layered structure having a first layer, a second layer and a third layer, and the second layer includes a plurality of air gaps separated arranged along the first direction.
1. A semiconductor memory device, comprising:
a plurality of bit lines, extended along a first direction;
a plurality of conductive patterns, extended along the first direction, the bit lines and the conductive patterns being alternately arranged along a second direction which is perpendicular to the first direction;
a plurality of conductive pads, disposed in an array arrangement, on the conductive patterns and the bit lines; and
a tri-layered spacer, disposed between the bit lines and the conductive patterns in the second direction, below the conductive pads, wherein the tri-layered spacer extends along the first direction and comprises a first layer, a second layer and a third layer, and the second layer comprises a plurality of air-gap layers separately disposed therein along the first direction, and the second layer comprises silicon oxide disposed alternately with the air gap layers in the first direction.
2. The semiconductor memory device according to claim 1 , further comprising:
a capping layer disposed on the air-gap layers.
3. The semiconductor memory device according to claim 2 , wherein the capping layer comprises a material the same as that of the first layer and the third layer.
4. The semiconductor memory device according to claim 1 , wherein the air-gap layers and the conductive pads are alternately arranged along a same horizontal surface.
5. A semiconductor memory device, comprising:
a plurality of bit lines, extended along a first direction;
a plurality of conductive patterns, extended along the first direction, the bit lines and the conductive patterns being alternately arranged along a second direction which is perpendicular to the first direction;
a plurality of conductive pads, disposed in an array arrangement, on the conductive patterns and the bit lines; and
a tri-layered spacer, disposed between the bit lines and the conductive patterns in the second direction, below the conductive pads, wherein the tri-layered spacer extends along the first direction and comprises a first layer, a second layer and a third layer, and the second layer comprises a plurality of fragments and a plurality of air-gap layers, wherein the air gap layers and the fragments are alternately arranged along the first direction.
6. The semiconductor memory device according to claim 5 , further comprising:
a capping layer disposed on the air-gap layers.
7. The semiconductor memory device according to claim 6 , wherein the capping layer comprises a material the same as that of the first layer and the third layer.
8. The semiconductor memory device according to claim 5 , wherein the air-gap layers and the conductive pads are alternately arranged along a same horizontal surface.
9. The semiconductor memory device according to claim 5 , wherein the fragments comprise silicon oxide.