Patent Assignment
Reel/Frame 045777/0637
Assignment of Assignor's Interest
Recorded: 2018-05-11
Pages: 4
Assignors
LUAN, HONGFA
Executed: 2018-04-19
CHANG, HUICHENG
Executed: 2018-04-19
CHAU, CHENG-PO
Executed: 2018-04-19
KU, WEN-YU
Executed: 2018-04-19
CHEN, YI-FAN
Executed: 2018-04-19
PENG, CHUN-YEN
Executed: 2018-04-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Method Of Forming A Semiconductor Device By High-pressure Anneal And Post-anneal Treatment