IP Library › Assignment 045782/0077
Patent Assignment
Reel/Frame 045782/0077

Assignment of Assignor's Interest

Recorded: 2018-05-11 Pages: 4
Assignor
LEE, SI-WOO
Executed: 2018-05-10
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MS 1- 525, BOISE, IDAHO, 83716
Covered Property (1)
Methods Used In Forming Integrated Circuitry Including Forming First, Second, and Third Contact Openings
Application: 15/977,622 →
Publication: US 2019/0348421
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Supplement No. 9 to Patent Security Agreement Aug 9, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 047282/0463 →
Release of Security Interest Oct 11, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050713/0001 →
Release of Security Interest Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →