Patent Assignment
Reel/Frame 045791/0336
Assignment of Assignor's Interest
Recorded: 2018-05-13
Pages: 4
Assignors
WANG, PO-HAN
Executed: 2018-03-30
KUO, HUNG-JUI
Executed: 2018-03-30
HU, YU-HSIANG
Executed: 2018-03-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Method of Fabricating Integrated Fan-Out Packages