Patent Assignment
Reel/Frame 045807/0174
Assignment of Assignor's Interest
Recorded: 2018-05-15
Pages: 5
Assignors
LEE, JEONG HO
Executed: 2017-04-26
KANG, MYUNG SAM
Executed: 2018-04-26
KO, YOUNG GWAN
Executed: 2018-04-30
KIM, JIN SU
Executed: 2018-04-26
SEO, SHANG HOON
Executed: 2018-04-26
LEE, JEONG IL
Executed: 2018-04-26
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Semiconductor Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.