Patent Assignment
Reel/Frame 045807/0444
Assignment of Assignor's Interest
Recorded: 2018-05-15
Pages: 5
Assignors
CHOI, IK JUN
Executed: 2018-02-19
LEE, JAE EAN
Executed: 2018-02-19
JEONG, KWANG OK
Executed: 2018-02-19
KO, YOUNG GWAN
Executed: 2018-02-19
BYUN, JUNG SOO
Executed: 2018-02-19
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Semiconductor Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.