IP Library › Assignment 045809/0281
Patent Assignment
Reel/Frame 045809/0281

Assignment of Assignor's Interest

Recorded: 2018-05-15 Pages: 17
Assignors
KIM, JIN YOUNG
Executed: 2013-07-25
PARK, NO SUN
Executed: 2013-07-25
KIM, YOON JOO
Executed: 2013-07-25
KIM, JIN HAN
Executed: 2013-07-25
LEE, SEUNG JAE
Executed: 2013-07-26
KIM, SUNG KYU
Executed: 2013-07-25
CHA, SE WOONG
Executed: 2013-09-03
RINNE, GLENN
Executed: 2013-08-12
LEE, CHOON HEUNG
Executed: 2013-07-30
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property (1)
Semiconductor Package and Manufacturing Method Thereof
Application: 15/211,534 →
Publication: US 2016/0322334
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →