Patent Assignment
Reel/Frame 045818/0942
Assignment of Assignor's Interest
Recorded: 2018-05-16
Pages: 12
Assignors
BILLINGSLEY, DANIEL
Executed: 2018-05-01
MCTEER, EVERETT A.
Executed: 2018-05-11
PETZ, CHRISTOPHER W.
Executed: 2018-05-01
LI, HAOYU
Executed: 2018-05-01
MELDRIM, JOHN MARK
Executed: 2018-04-30
HU, YONGJUN JEFF
Executed: 2018-05-01
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MS 1-525, BOISE, IDAHO, 83716
Covered Property
(1)
Integrated Assemblies and Methods of Forming Integrated Assemblies
Patent:
10,354,989 →
Application:
15/980,908 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Supplement No. 9 to Patent Security Agreement
Aug 9, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 047282/0463 →
Release of Security Interest
Oct 11, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050713/0001 →
Release of Security Interest
Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →