Patent Assignment
Reel/Frame 045824/0704
Assignment of Assignor's Interest
Recorded: 2018-05-16
Pages: 5
Assignors
LEE, JEONG HO
Executed: 2018-05-03
KANG, MYUNG SAM
Executed: 2018-05-03
KO, YOUNG GWAN
Executed: 2018-05-03
SEO, SAHNG HOON
Executed: 2018-05-03
KIM, JIN SU
Executed: 2018-05-03
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Semiconductor Package
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 28, 2018
From: LEE, JEONG HO; KANG, MYUNG SAM; KO, YOUNG GWAN; SEO, SHANG HOON
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 046725/0152 →
Assignment of Assignor's Interest
Jun 3, 2019
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 049350/0756 →