IP Library › Assignment 045845/0594
Patent Assignment
Reel/Frame 045845/0594

Assignment of Assignor's Interest

Recorded: 2018-05-18 Pages: 4
Assignor
EPCOS AG
Executed: 2018-03-05
Assignee
TDK CORPORATION
3-9-1 SHIBAURA, MINATO-KU, TOKYO, 108-0023, JAPAN
Covered Properties (4)
Microphone Assembly and Method for Determining Parameters of a Transducer in a Microphone Assembly
Patent: 9,955,273 →
Application: 15/301,663 →
Publication: US 2017/0118570
Microphone Assembly and Method of Reducing a Temperature Dependency of a Microphone Assembly
Application: 15/304,961 →
Publication: US 2017/0188145
Microphone Assembly and Method of Manufacturing a Microphone Assembly
Application: 15/306,928 →
Publication: US 2017/0055056
Microphone and Method of Manufacturing a Microphone
Application: 15/318,752 →
Publication: US 2017/0150276
Related Assignments (6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 15, 2017
From: EPCOS AG
To: TDK CORPORATION
Reel/Frame 041263/0032 →
Assignment of Assignor's Interest Feb 21, 2017
From: ROCCA, GINO
To: EPCOS AG
Reel/Frame 041321/0095 →
Assignment of Assignor's Interest Feb 21, 2017
From: RASMUSSEN, KURT
To: EPCOS AG
Reel/Frame 041322/0811 →
Assignment of Assignor's Interest Feb 22, 2017
From: ROCCA, GINO
To: EPCOS AG
Reel/Frame 041342/0812 →
Assignment of Assignor's Interest Mar 3, 2017
From: ROCCA, GINO; RAVNKILDE, JAN TUE
To: EPCOS AG
Reel/Frame 041459/0639 →
Assignment of Assignor's Interest Oct 13, 2025
From: TDK CORPORATION
To: INVENSENSE, INC.
Reel/Frame 073080/0824 →