Patent Assignment
Reel/Frame 045867/0297
Assignment of Assignor's Interest
Recorded: 2018-05-22
Pages: 5
Assignors
SUN, JIWEI
Executed: 2018-05-15
PARK, JI YONG
Executed: 2018-05-14
LEE, KYU OH
Executed: 2018-05-21
DENG, YIKANG
Executed: 2018-05-14
ZHANG, ZHICHAO
Executed: 2018-05-15
CHENG, LIWEI
Executed: 2018-05-14
BROWN, ANDREW JAMES
Executed: 2018-05-14
XU, CHENG
Executed: 2018-05-15
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Microelectronic Assemblies Having Conductive Structures with Different Thicknesses on a Core Substrate