Microelectronic assemblies having conductive structures with different thicknesses on a core substrate
Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a core substrate with a first conductive structure having a first thickness on the core substrate, and a second conductive structure having a second thickness on the core substrate, where the first thickness is different than the second thickness.
1. A microelectronic assembly, comprising:
a package substrate including a core having a surface;
a first conductive feature, having a first thickness and a first length, directly on the surface of the core, wherein the first conductive feature includes a trace, and wherein the first length is between 15 microns and 30 microns; and
a second conductive feature having a second thickness directly on the surface of the core, wherein the second conductive feature includes a trace or a pad, wherein the second thickness is different than the first thickness, and wherein the second conductive feature is spaced apart from the first conductive feature by a distance between 15 microns and 30 microns.
2. The microelectronic assembly of claim 1 , wherein the second thickness is greater than the first thickness.
3. The microelectronic assembly of claim 1 , wherein the core has a thickness between 50 um and 150 um.
4. The microelectronic assembly of claim 1 , wherein the core has a thickness between 60 um and 180 um.
5. The microelectronic assembly of claim 1 , wherein the core has a thickness between 150 um and 250 um.
6. The microelectronic assembly of claim 1 , wherein the first thickness is between 10 um and 30 um.
7. The microelectronic assembly of claim 1 , wherein the second thickness is between 15 um and 35 um.
8. The microelectronic assembly of claim 1 , further comprising:
a plated through hole in the core.
9. The microelectronic assembly of claim 1 , wherein the first conductive feature is electrically coupled to an electrical signal.
10. The microelectronic assembly of claim 1 , wherein the second conductive feature is electrically coupled to a power plane or a ground plane.
11. The microelectronic assembly of claim 1 , further comprising:
a die electrically coupled to the package substrate.
12. The microelectronic assembly of claim 11 , wherein the die is a central processing unit, a radio frequency chip, a power converter, or a network processor.
13. A microelectronic assembly, comprising:
a package substrate, the package substrate comprising:
a core having a surface; and
a first trace, having a first thickness and a first length, directly on the surface of the core, wherein the first length is between 15 microns and 30 microns; and
a second trace having a second thickness directly on the surface of the core, wherein the second thickness is different than the first thickness, wherein the second trace is spaced apart from the first trace by a distance between 15 microns and 30 microns; and
a die coupled to the package substrate and electrically coupled to the first trace via conductive pathways in the package substrate.
14. The microelectronic assembly of claim 13 , wherein the second thickness is greater than the first thickness.
15. The microelectronic assembly of claim 13 , wherein the core has a thickness between 50 um and 150 um.
16. The microelectronic assembly of claim 13 , wherein the core has a thickness between 150 um and 250 um.
17. The microelectronic assembly of claim 13 , wherein the first thickness is between 10 um and 30 um.
18. The microelectronic assembly of claim 13 , wherein the second thickness is between 15 um and 35 um.
19. The microelectronic assembly of claim 13 , wherein the first trace is electrically coupled to an electrical signal.
20. The microelectronic assembly of claim 13 , wherein the second trace is electrically coupled to a power plane or a ground plane.