Patent Assignment
Reel/Frame 045883/0253
Assignment of Assignor's Interest
Recorded: 2018-05-23
Pages: 2
Assignors
CHEN, MING-FA
Executed: 2018-05-08
CHEN, HSIEN-WEI
Executed: 2018-05-08
HU, CHIH-CHIA
Executed: 2018-05-08
YU, CHEN-HUA
Executed: 2018-05-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Mixing Organic Materials into Hybrid Packages