Patent Assignment
Reel/Frame 045901/0495
Assignment of Assignor's Interest
Recorded: 2018-05-25
Pages: 5
Assignors
LEE, JEONG HO
Executed: 2018-05-17
CHU, BONG JU
Executed: 2018-05-17
KO, YOUNG GWAN
Executed: 2018-05-17
KIM, JIN SU
Executed: 2018-05-17
SEO, SHANG HOON
Executed: 2018-05-17
LEE, JEONG IL
Executed: 2018-05-17
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Semiconductor Package
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Second Assignor Name Previously Recorded at Reel: 045901 Frame: 0495. Assignor(S) Hereby Confirms the Assignment .
Jun 18, 2018
From: LEE, JEONG HO; CHO, BONG JU; KO, YOUNG GWAN; KIM, JIN SU
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 046377/0256 →
Assignment of Assignor's Interest
Jun 3, 2019
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 049350/0756 →