Patent Assignment
Reel/Frame 045948/0020
Assignment of Assignor's Interest
Recorded: 2018-05-31
Pages: 2
Assignors
LEE, HYUN WOO
Executed: 2018-05-30
JEONG, JIN WOOK
Executed: 2018-05-30
KIM, HYUN JOO
Executed: 2018-05-30
OCK, JIN YOUNG
Executed: 2018-05-30
Assignee
HANA MICRON INC.
77 YEONAMYULGEUM-RO, EUMBONG-MYEON, ASAN-SI, CHUNGCHEONGNAM-DO, 31413, KOREA, REPUBLIC OF
Covered Property
(1)
Metal Core Solder Ball Interconnector Fan-Out Wafer Level Package