Patent Assignment
Reel/Frame 045950/0847
Assignment of Assignor's Interest
Recorded: 2018-05-31
Pages: 4
Assignors
KAWANA, YUKI
Executed: 2018-03-27
KURAFUCHI, KAZUHIKO
Executed: 2018-03-20
EJIRI, YOSHINORI
Executed: 2018-03-21
NAKAKO, HIDEO
Executed: 2018-03-20
SUGAMA, CHIE
Executed: 2018-03-21
ISHIKAWA, DAI
Executed: 2018-04-12
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Copper Paste for Joining, Method for Producing Joined Body, and Method for Producing Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →