Patent Assignment
Reel/Frame 045970/0934
Assignment of Assignor's Interest
Recorded: 2018-06-04
Pages: 16
Assignors
KUO, CHIA-MING
Executed: 2018-05-31
CHUANG, PO-JEN
Executed: 2018-05-31
WANG, YU-REN
Executed: 2018-05-31
YEN, YING-WEI
Executed: 2018-05-31
CHUANG, FU-JUNG
Executed: 2018-05-31
HSIAO, YA-YIN
Executed: 2018-05-31
HUANG, NAN-YUAN
Executed: 2018-05-31
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Device and Method for Fabricating the Same