Patent Assignment
Reel/Frame 045977/0516
Assignment of Assignor's Interest
Recorded: 2018-06-04
Pages: 4
Assignors
CHING, KUO-CHENG
Executed: 2017-06-07
TSAI, CHING-WEI
Executed: 2017-06-12
CHENG, KUAN-LUN
Executed: 2017-06-08
WANG, CHIH-HAO
Executed: 2017-06-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device on Hybrid Substrate