Patent Assignment
Reel/Frame 046007/0783
Assignment of Assignor's Interest
Recorded: 2018-06-07
Pages: 10
Assignors
CHEN, YI-WEI
Executed: 2018-05-31
WANG, HSU-YANG
Executed: 2018-05-31
CHIU, CHUN-CHIEH
Executed: 2018-05-31
TZOU, SHIH-FANG
Executed: 2018-05-31
Assignees
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
FUJIAN JINHUA INTEGRATED CIRCUIT CO., LTD.
NO.88, LIANHUA AVENUE, INTEGRATED CIRCUIT SCIENCE PARK, JINJIANG CITY, QUANZHOU CITY, FUJIAN PROVINCE, CHINA
Covered Property
(1)
Method of Forming Semiconductor Memory Device