Patent Assignment
Reel/Frame 046008/0476
Assignment of Assignor's Interest
Recorded: 2018-06-07
Pages: 10
Assignors
QU, LIANJIE
Executed: 2018-03-10
QIU, YUN
Executed: 2018-03-12
WANG, DAN
Executed: 2018-03-13
ZHAO, HEBIN
Executed: 2018-03-13
Assignees
BOE TECHNOLOGY GROUP CO., LTD.
NO. 10 JIUXIANQIAO RD., CHAOYANG DISTRICT, BEIJING, 100015, CHINA
BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
NO. 118 JINGHAIYILU, BDA, BEIJING, 100176, CHINA
Covered Property
(1)
Chip Encapsulating Method and Chip Encapsulating Structure