Patent Assignment
Reel/Frame 046020/0277
Assignment of Assignor's Interest
Recorded: 2018-06-07
Pages: 9
Assignors
YANG, GUANGJUN
Executed: 2018-05-25
AKHTAR, MOHD KAMRAN
Executed: 2018-05-25
BORSARI, SILVIA
Executed: 2018-05-25
SCHRINSKY, ALEX J.
Executed: 2018-06-06
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MS 1-525, BOISE, IDAHO, 83716
Covered Property
(1)
Methods of Forming Integrated Assemblies Having Dielectric Regions Along Conductive Structures
Patent:
10,347,643 →
Application:
16/002,890 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Supplement No. 9 to Patent Security Agreement
Aug 9, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 047282/0463 →
Release of Security Interest
Oct 11, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050713/0001 →
Release of Security Interest
Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →