Patent Assignment
Reel/Frame 046050/0141
Assignment of Assignor's Interest
Recorded: 2018-06-12
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Pad Structure and Manufacturing Method Thereof in Semiconductor Device