Patent Assignment
Reel/Frame 046057/0320
Assignment of Assignor's Interest
Recorded: 2018-06-12
Pages: 6
Assignors
SUK, KYUONG LIM
Executed: 2018-05-29
RYU, SEUNG-KWAN
Executed: 2018-05-29
LEE, SEOKHYUN
Executed: 2018-05-29
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Fabricating the Same