Semiconductor package and method of fabricating the same
A method of fabricating a semiconductor package includes forming a capping pattern on a chip pad of a semiconductor device. The semiconductor device includes a passivation pattern that exposes a portion of the chip pad, and the capping pattern covers the chip pad. The method further includes forming a redistribution layer on the capping pattern. Forming the redistribution layer includes forming a first insulation pattern on the capping pattern and the passivation pattern, forming a first opening in the first insulation pattern by performing exposure and development processes on the first insulation pattern, in which the first opening exposes a portion of the capping pattern, and forming a redistribution pattern in the first opening.
1. A method of fabricating a semiconductor package, the method comprising:
forming a capping pattern on a chip pad of a semiconductor device,
wherein the semiconductor device comprises a passivation pattern that exposes a portion of the chip pad, and the capping pattern covers the chip pad;
forming a redistribution layer on the capping pattern; and
forming a conductive structure on the redistribution layer, the conductive structure spaced apart from the semiconductor device and electrically connected to the redistribution layer,
wherein forming the redistribution layer comprises:
forming a first insulation pattern on the capping pattern and the passivation pattern;
forming a first opening in the first insulation pattern by performing exposure and development processes on the first insulation pattern, wherein the first opening exposes a portion of the capping pattern; and
forming a redistribution pattern in the first opening.
2. The method of claim 1 , further comprising:
disposing the semiconductor device on a carrier substrate to provide a first surface of the semiconductor device toward the carrier substrate, the capping pattern disposed on the first surface of the semiconductor device;
forming a molding pattern on the carrier substrate and the semiconductor device, wherein the molding pattern covers the semiconductor device; and
exposing the capping pattern and a bottom surface of the molding pattern by removing the carrier substrate,
wherein the redistribution layer is formed on the exposed capping pattern and the exposed bottom surface of the molding pattern.
3. The method of claim 2 , wherein the redistribution layer is in direct contact with the bottom surface of the molding pattern.
4. The method of claim 1 ,
wherein the redistribution layer extends onto a bottom surface of the conductive structure and contacts the conductive structure.
5. The method of claim 2 , further comprising:
forming an upper redistribution pattern on a top surface of the molding pattern.
6. The method of claim 1 , further comprising:
disposing the semiconductor device in a hole of a connection substrate,
wherein the hole penetrates the connection substrate, and the redistribution layer extends onto the connection substrate.
7. The method of claim 1 , wherein forming the capping pattern comprises:
forming a seed layer on the passivation pattern and the chip pad;
forming a resist layer on the seed layer; and
forming a conductive pattern on a portion of the seed layer exposed by the resist layer by performing an electroplating process on the seed layer.
8. The method of claim 1 , further comprising:
etching the passivation pattern to expose the portion of the chip pad, wherein, before etching the passivation pattern, the passivation pattern covers the portion of the chip pad; and
removing impurities from the chip pad by performing a heat treatment process on the exposed portion of the chip pad.
9. The method of claim 1 , further comprising:
forming a molding pattern on the semiconductor device, the molding pattern covering a sidewall of the semiconductor device,
wherein the molding pattern is spaced apart from the capping pattern.
10. The method of claim 9 , further comprising:
forming an upper redistribution pattern on the conductive structure and a top surface of the molding pattern, the upper redistribution pattern electrically connected to the conductive structure.
11. The method of claim 9 , wherein the molding pattern does not cover a top surface of the conductive structure.
12. A method of fabricating a semiconductor package, the method comprising:
preparing a semiconductor device comprising a chip pad, a passivation pattern, and a capping pattern, wherein the passivation pattern comprises an opening that exposes a portion of the chip pad; and
wherein the capping pattern is formed in the opening and covers the chip pad;
disposing the semiconductor device on a redistribution layer;
forming a conductive structure on the redistribution layer, the conductive structure spaced apart from the semiconductor device and electrically connected to the redistribution layer; and
electrically connecting the chip pad to the redistribution layer by forming a connector between the capping pattern and the redistribution layer.
13. The method of claim 12 , wherein the connector is in direct contact with the capping pattern and is spaced apart from the chip pad.
14. The method of claim 12 , further comprising:
forming a molding pattern on the redistribution layer, wherein the molding pattern covers the semiconductor device.
15. The method of claim 12 , further comprising:
disposing a connection substrate having a hole on the redistribution layer,
wherein the semiconductor device is disposed in the hole of the connection substrate.
16. The method of claim 12 wherein the conductive structure is formed by disposing a metal pillar on the redistribution layer.
17. The method of claim 12 , further comprising:
forming the redistribution layer by forming an insulation pattern and a redistribution pattern on a carrier substrate,
wherein the insulation pattern comprises a photosensitive polymer.
18. The method of claim 12 , further comprising:
etching the passivation pattern to form the opening.