Patent Assignment
Reel/Frame 046069/0547
Assignment of Assignor's Interest
Recorded: 2018-06-13
Pages: 3
Assignors
CHANG, HUNG-JEN
Executed: 2018-06-12
CHEN, JEN-CHUAN
Executed: 2018-06-12
WANG, HSUEH-TE
Executed: 2018-06-12
HSU, WEN-SUNG
Executed: 2018-06-12
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Package Including Emi Shielding Structure and Method for Forming the Same