IP Library › Assignment 046079/0686
Patent Assignment
Reel/Frame 046079/0686

Assignment of Assignor's Interest

Recorded: 2018-06-13 Pages: 7
Assignors
ZHAO, WEI
Executed: 2018-05-08
CUI, WEI
Executed: 2018-05-08
YU, LIN
Executed: 2018-05-08
Assignee
HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.,
NO. 218 QIAN WANGANG ROAD, ECONOMIC AND TECHNICAL DEVELOPMENT ZONE, QINGDAO, SHANDONG, 266555, CHINA
Covered Property (1)
Pluggable Printed Circuit Board And Optical Module having a gap between solder resist and electro-conductive contact sheet group
Application: 15/982,240 →
Publication: US 2018/0270954
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of an Undivided Interest Jun 13, 2018
From: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.,
To: HISENSE USA CORPORATION; HISENSE INTERNATIONAL CO., LTD.,
Reel/Frame 046355/0415 →