Pluggable printed circuit board and optical module having a gap between solder resist and electro-conductive contact sheet group
The application provides a printed circuit board and an optical module so as to alleviate poor contact between the electro-conductive contact sheet group and the clamping piece due to the solder resist. The printed circuit board includes a substrate, and electro-conductive contact sheet group positioned on the surface of the substrate, where a part of the substrate is overlaid with solder resist, and there is a gap between the solder resist and the electro-conductive contact sheet group.
1. A printed circuit board, comprising:
a substrate; and
an electro-conductive contact sheet group;
wherein the electro-conductive contact sheet group is positioned on a surface of the substrate, a part of the substrate is overlaid with solder resist, and there is a gap between the solder resist and the electro-conductive contact sheet group.
2. The printed circuit board according to claim 1 , wherein a thickness of the solder resist is more than a thickness of the electro-conductive contact sheet group.
3. The printed circuit board according to claim 1 , wherein the printed circuit board further comprises electro-conductive wirings positioned on the surface of the substrate, and a part of the electro-conductive wirings positioned on the surface of the substrate is overlaid with the solder resist.
4. The printed circuit board according to claim 3 , wherein a thickness of the electro-conductive wirings is almost equal to a thickness of the electro-conductive contact sheet group.
5. The printed circuit board according to claim 1 , wherein the printed circuit board further comprises electro-conductive wirings positioned on the surface of the substrate, and the electro-conductive wirings positioned on the surface of the substrate are not overlaid with the solder resist.
6. The printed circuit board according to claim 1 , wherein a width of the gap between the solder resist and the electro-conductive contact sheet group is in a range between 0.6 mm to 1 mm.
7. The printed circuit board according to claim 6 , wherein the width of the gap between the solder resist and the electro-conductive contact sheet group is almost 0.8 mm.
8. The printed circuit board according to claim 6 , wherein the electro-conductive contact sheet group comprises a number of electro-conductive contact sheets having a same length, and the distance between the solder resist and the electro-conductive contact sheet group refers to a distance between the solder resist and any one of the electro-conductive contact sheets.
9. The printed circuit board according to claim 6 , wherein the electro-conductive contact sheet group comprises a number of electro-conductive contact sheets having different lengths, and the distance between the solder resist and the electro-conductive contact sheet group refers to a largest one of distances between the solder resist and the electro-conductive contact sheets.
10. The printed circuit board according to claim 1 , wherein the solder resist is liquid photoinduced solder resist.
11. The printed circuit board according to claim 10 , wherein the liquid photoinduced solder resist is green liquid photoinduced solder resist.
12. An optical module, comprising:
an optical transmitter;
an optical receiver; and
a printed circuit board, wherein the printed circuit board comprises a substrate, and an electro-conductive contact sheet group;
wherein the electro-conductive contact sheet group is positioned on a surface of the substrate, a part of the substrate is overlaid with solder resist, and there is a gap between the solder resist and the electro-conductive contact sheet group.
13. The optical module according to claim 12 , wherein a thickness of the solder resist is more than a thickness of the electro-conductive contact sheet group.
14. The optical module according to claim 12 , wherein the printed circuit board further comprises electro-conductive wirings positioned on the surface of the substrate, and a part of the electro-conductive wirings is overlaid with the solder resist.
15. The optical module according to claim 14 , wherein a thickness of the electro-conductive wirings is almost equal to a thickness of the electro-conductive contact sheet group.
16. The optical module according to claim 12 , wherein the printed circuit board further comprises electro-conductive wirings positioned on the surface of the substrate, and the electro-conductive wirings are not overlaid with the solder resist.
17. The optical module according to claim 12 , wherein a width of the gap between the solder resist and the electro-conductive contact sheet group is in a range between 0.6 mm to 1 mm.
18. The optical module according to claim 17 , wherein the width of the gap between the solder resist and the electro-conductive contact sheet group is 0.8 mm.
19. The optical module according to claim 17 , wherein the electro-conductive contact sheet group comprises a number of electro-conductive contact sheets having a same length, and the distance between the solder resist and the electro-conductive contact sheet group refers to a distance between the solder resist and any one of the electro-conductive contact sheets.
20. The optical module according to claim 17 , wherein the electro-conductive contact sheet group comprises a number of electro-conductive contact sheets having different lengths, and the distance between the solder resist and the electro-conductive contact sheet group refers to a largest one of distances between the solder resist and the electro-conductive contact sheets.