Patent Assignment
Reel/Frame 046113/0713
Assignment of Assignor's Interest
Recorded: 2018-05-10
Pages: 4
Assignors
CHI, CHIH-CHIEN
Executed: 2018-02-13
WEI, HSIAO-KUAN
Executed: 2018-02-13
SU, HUNG-WEN
Executed: 2018-02-21
LEE, PEI-HSUAN
Executed: 2018-02-13
HSU, HSIN-YUN
Executed: 2018-02-13
CHIEN, JUI-FEN
Executed: 2018-02-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Selective Capping Processes and Structures Formed Thereby