Patent Assignment
Reel/Frame 046123/0741
Assignment of Assignor's Interest
Recorded: 2018-06-18
Pages: 5
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Metal Interconnect Structure and Method for Fabricating the Same