Patent Assignment
Reel/Frame 046189/0615
Assignment of Assignor's Interest
Recorded: 2018-06-25
Pages: 9
Assignors
KIM, HEE SUNG
Executed: 2017-03-14
KO, YEOUNG BEOM
Executed: 2017-03-08
KANG, DAE BYOUNG
Executed: 2017-03-03
LEE, JAE JIN
Executed: 2017-03-08
KIM, JOON DONG
Executed: 2017-03-14
KIM, DONG JEAN
Executed: 2017-03-14
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property
(1)
Semiconductor Package and Fabricating Method Thereof
Patent:
10,037,949 →
Application:
15/447,831 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.