Semiconductor package and fabricating method thereof
A semiconductor package that includes EMI shielding and a fabricating method thereof are disclosed. In one embodiment, the fabricating method of a semiconductor package includes forming a substrate, attaching semiconductor devices to a top portion of the substrate, encapsulating the semiconductor devices using an encapsulant, forming a trench in the encapsulant, and forming a shielding layer on a surface of the encapsulant.
1. A method of fabricating a semiconductor package, comprising:
forming a substrate, comprising:
forming a first substrate part on a support layer, the first substrate part including a first conductive structure and a first dielectric structure;
attaching a first carrier to a top portion of the first substrate part;
removing the support layer; and
forming a second substrate part on the first substrate part, the second substrate part including a second conductive structure and a second dielectric structure;
attaching a first semiconductor device to a top portion of the substrate;
encapsulating the first semiconductor device using an encapsulant;
forming a trench in the encapsulant; and
forming a shielding layer on a surface of the encapsulant.
2. The method according to claim 1 , comprising:
after forming the shielding layer, attaching a second carrier to the shielding layer formed on a top side of the encapsulant;
removing the first carrier; and
forming conductive bumps on the first substrate part.
3. The method according to claim 2 , comprising attaching a second semiconductor device having a smaller height than the conductive bumps to the first substrate part.
4. The method according to claim 1 , wherein the trench is formed to pass through the encapsulant and the substrate.
5. The method according to claim 1 , wherein the shielding layer is formed on a top surface of the encapsulant, side surfaces of the encapsulant, and side surfaces of the substrate.
6. The method according to claim 1 , wherein the shielding layer is electrically connected to a ground of the substrate.
7. The method according to claim 1 , wherein the substrate is a printed circuit board having a core.
8. The method according to claim 1 , comprising, after the encapsulating, forming conductive bumps on the substrate.
9. The method according to claim 8 , comprising:
attaching a carrier to a top portion of the encapsulant; and
forming the trench to pass through the substrate and the encapsulant.
10. The method according to claim 9 , comprising prior to forming the shielding layer:
attaching an adhesion member to the substrate to enclose the conductive bumps; and
removing the carrier.
11. A method of fabricating a semiconductor package, comprising:
forming a first substrate part on a support layer;
attaching a semiconductor device to a top side of the first substrate part;
encapsulating the semiconductor device using an encapsulant;
forming a trench in the encapsulant;
forming a shielding layer on a top surface of the encapsulant; and
forming a second substrate part on the first substrate part, comprising:
attaching a carrier on the shielding layer; and
removing the support layer,
wherein the second substrate part comprises a conductive structure and a dielectric structure.
12. The method according to claim 11 , wherein forming the first substrate part comprises forming the first substrate part including a conductive structure and a dielectric structure.
13. The method according to claim 11 , wherein forming the trench comprises forming the trench to pass through the encapsulant, the first substrate part, and a portion of the support layer.
14. The method according to claim 11 , comprising injecting a photoresist material into the trench.
15. The method according to claim 11 , comprising, after forming the second substrate part, forming conductive bumps on the second substrate part.
16. A method of fabricating a semiconductor package, comprising:
forming a substrate;
attaching a first semiconductor device to a top portion of the substrate;
encapsulating the first semiconductor device using an encapsulant;
after the encapsulating forming conductive bumps on the substrate;
attaching a carrier to a top portion of the encapsulant;
forming a trench to pass through the substrate and the encapsulant; and
forming a shielding layer on a surface of the encapsulant.
17. The method according to claim 16 , wherein the shielding layer is formed on a top surface of the encapsulant, side surfaces of the encapsulant, and side surfaces of the substrate.
18. The method according to claim 16 , wherein the shielding layer is electrically connected to a ground of the substrate.
19. The method according to claim 16 , wherein the substrate is a printed circuit board having a core.
20. The method according to claim 16 , comprising prior to forming the shielding layer:
attaching an adhesion member to the substrate to enclose the conductive bumps; and
removing the carrier.