Methods for making semiconductor devices
View Patent ↗A method for making semiconductor devices includes: attaching a substrate with a plurality of electronic components onto a composite tape having an adhesive layer which is sensitive to ultraviolet (UV) irradiation and a UV-transparent base film, wherein the substrate is attached onto the adhesive layer of the composite tape; placing the substrate and the composite tape on a UV-transparent carrier, wherein the UV-transparent carrier is in contact with the UV-transparent base film of the composite tape; singulating the substrate into a plurality of semiconductor devices each having one of the plurality of electronic components; depositing a shielding material on the plurality of semiconductor devices to form a shielding layer on each of the plurality of semiconductor devices; irradiating a UV light to the composite tape through the UV-transparent carrier to reduce adhesivity of the adhesive layer; and detaching the plurality of semiconductor devices from the UV-transparent carrier.
1 . A method for making semiconductor devices, comprising:
attaching a substrate with a plurality of electronic components onto a composite tape having an adhesive layer which is sensitive to ultraviolet (UV) irradiation and a UV-transparent base film, wherein the substrate is attached onto the adhesive layer of the composite tape;
placing the substrate and the composite tape on a UV-transparent carrier, wherein the UV-transparent carrier is in contact with the UV-transparent base film of the composite tape;
singulating the substrate into a plurality of semiconductor devices each having one of the plurality of electronic components, including:
forming between each two adjacent electronic components a trench that extends through the substrate and at least into the adhesive layer of the composite tape without exposing the UV-transparent carrier;
depositing a shielding material on the plurality of semiconductor devices to form a shielding layer on each of the plurality of semiconductor devices;
irradiating a UV irradiation to the composite tape through the UV-transparent carrier to reduce adhesivity of the adhesive layer; and
detaching the plurality of semiconductor devices from the UV-transparent carrier.
2 . The method of claim 1 , wherein the trenches do not extend through the UV-transparent base film.
3 . The method of claim 1 , wherein the substrate comprises one or more electrically conductive layers or redistribution layers.
4 . The method of claim 1 , wherein the electronic components comprise one or more semiconductor dice or semiconductor packages.
5 . The method of claim 1 , wherein the UV-transparent base film comprises a polyimide film.
6 . The method of claim 1 , wherein the UV-transparent carrier comprises a sapphire carrier or a glass carrier.
7 . The method of claim 1 , wherein the substrate comprises land grid array (LGA) contacts or ball grid array (BGA) bumps.
8 . A method for making semiconductor devices, comprising:
attaching a substrate with a plurality of electronic components onto a composite tape having an adhesive layer which is sensitive to ultraviolet (UV) irradiation and a UV-transparent base film, wherein the substrate is attached onto the adhesive layer of the composite tape;
placing the substrate and the composite tape on a UV-transparent carrier, wherein the UV-transparent carrier is in contact with the UV-transparent base film of the composite tape;
depositing a shielding material on the substrate;
singulating the substrate into a plurality of semiconductor devices each having one of the plurality of electronic components, including:
forming between each two adjacent electronic components a trench that extends through the substrate and at least into the adhesive layer of the composite tape without exposing the UV-transparent carrier;
irradiating a UV light to the composite tape through the UV-transparent carrier to reduce adhesivity of the adhesive layer; and
detaching the plurality of semiconductor devices from the UV-transparent carrier.
9 . The method of claim 8 , wherein the substrate comprises one or more electrically conductive layers or redistribution layers.
10 . The method of claim 8 , wherein the electronic components comprise one or more semiconductor dice or semiconductor packages.
11 . The method of claim 8 , wherein the UV-transparent film comprises a polyimide film.
12 . The method of claim 8 , wherein the UV-transparent carrier comprises a sapphire carrier or a glass carrier.
13 . The method of claim 8 , wherein the substrate comprises land grid array (LGA) contacts or ball grid array (BGA) bumps.