Patent Assignment
Reel/Frame 046191/0397
Assignment of Assignor's Interest
Recorded: 2018-06-25
Pages: 3
Assignor
ODNOBLYUDOV, VLADIMIR
Executed: 2011-07-25
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Wafer-Level Solid State Transducer Packaging Transducers Including Separators and Associated Systems and Methods
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 9 to Patent Security Agreement
Aug 9, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 047282/0463 →
Release of Security Interest
Oct 11, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050713/0001 →