Wafer-level solid state transducer packaging transducers including separators and associated systems and methods
Wafer-level packaging of solid-state transducers (“SSTs”) is disclosed herein. A method in accordance with a particular embodiment includes forming a transducer structure having a first surface and a second surface opposite the first surface, and forming a plurality of separators that extend from at least the first surface of the transducer structure to beyond the second surface. The separators can demarcate lateral dimensions of individual SSTs. The method can further include forming a support substrate on the first surface of the transducer structure, and forming a plurality of discrete optical elements on the second surface of the transducer structure. The separators can form barriers between the discrete optical elements. The method can still further include dicing the SSTs along the separators. Associated SST devices and systems are also disclosed herein.
1. A solid-state transducer (SST) assembly comprising:
a support substrate;
a barrier material positioned over the support substrate;
a seed material positioned over the barrier material;
a plurality of SSTs, wherein individual SSTs include (a) a first contact, (b) a transducer structure having a first surface and a second surface opposite the first surface, and (c) a second contact having an uppermost surface; and
a plurality of separators demarcating the individual SSTs, wherein the separators include at least one generally V-shaped protrusion of the barrier material, the seed material, and a dielectric material over the seed material that extends past the second surface of the plurality of SSTs, such that upper portions of the seed material and barrier material in the protrusions extend above the uppermost surface of the second contacts.
2. The SST assembly of claim 1 further comprising a plurality of discrete optical elements over the second surface of the transducer structure of corresponding ones of the SSTs, wherein each of the discrete optical elements includes a cover element.
3. The SST assembly of claim 2 wherein the cover element includes a topmost surface above a topmost surface of the dielectric material.
4. The SST assembly of claim 2 wherein the cover element includes a topmost surface below a topmost surface of the dielectric material.
5. The SST assembly of claim 2 wherein the dielectric material of each of the separators abuts the cover element of a corresponding one of the discrete optical elements.
6. The SST assembly of claim 1 wherein the support substrate comprises a metal material, wherein each of the separators comprises the portion of the metal material, and wherein the portion of the metal material projects beyond the second surface of the transducer structure.
7. The SST assembly of claim 1 wherein the support substrate comprises a plated metal that forms a portion of the separators.
8. The SST assembly of claim 7 wherein the plated metal has a thickness between approximately 50 μm and approximately 300 μm.
9. The SST assembly of claim 1 wherein SSTs are configured to emit electromagnetic radiation in at least one of the ultraviolet spectrum, the visible spectrum, and the infrared spectrum.
10. A solid state transducer (SST), comprising:
a transducer structure having a first surface and a second surface opposite the first surface;
a contact on the second surface of the transducer structure;
a support substrate adjacent the first surface, the support substrate including a metal material;
a barrier material having a portion between the support substrate and the transducer structure, wherein the barrier material includes a topmost surface extending beyond the second surface of the transducer structure;
a seed material over the barrier material, wherein the seed material includes a topmost surface extending beyond the second surface of the transducer structure;
a V-shaped protrusion around a periphery of the transducer structure, the V-shaped protrusion including a dielectric material projecting from a portion of the metal material past the second surface of the transducer structure, the portion of the barrier material and the portion of the seed material; and
an optical element over the second surface of the transducer structure.
11. The SST of claim 10 wherein the optical element includes a cover element and a converter element between the cover element and the transducer structure, the cover element including a topmost surface that is above a topmost surface of the dielectric material of the protrusion.
12. The SST of claim 10 wherein the optical element includes a cover element and a converter element between the cover element and the transducer structure, the cover element including a topmost surface that is below a topmost surface of the dielectric material of the protrusion.
13. The SST of claim 10 wherein the converter element and the cover element are confined within the protrusion.
14. The SST of claim 10 wherein a lowermost surface of the dielectric material is co-planar with the first surface of the transducer structure.
15. The SST of claim 10 wherein the metal material comprises a plated metal that defines a portion of the protrusion.
16. The SST of claim 10 wherein the SST is configured to emit electromagnetic radiation in at least one of the ultraviolet spectrum, the visible spectrum, and the infrared spectrum.
17. The SST of claim 10 wherein the contact is one of a plurality of second contacts on the second surface of the transducer structure, the SST further comprising a first contact proximate the first surface of the transducer structure.
18. The SST of claim 17 wherein each of the second contacts includes at least one of an yttrium aluminum garnet, silicate phosphor, nitrate phosphor and aluminate phosphor.
19. The SST of claim 17 wherein a discrete optical element encapsulates the plurality of second contacts.
20. The SST of claim 10 wherein the dielectric material is formed from a single, uniform material and has straight edges.