Patent Assignment
Reel/Frame 046195/0870
Assignment of Assignor's Interest
Recorded: 2018-06-25
Pages: 3
Assignors
PENG, YU-YUN
Executed: 2018-06-08
KO, CHUNG-CHI
Executed: 2018-06-08
LIN, KENG-CHU
Executed: 2018-06-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Device and Method of Dielectric Layer