Patent Assignment
Reel/Frame 046220/0993
Assignment of Assignor's Interest
Recorded: 2018-06-27
Pages: 4
Assignors
YEH, TING-YU
Executed: 2018-05-29
HSU, CHIA-HAO
Executed: 2018-05-29
CHEN, WEIMING CHRIS
Executed: 2018-05-29
TING, KUO-CHIANG
Executed: 2018-05-29
YU, TU-HAO
Executed: 2018-05-29
HOU, SHANG-YUN
Executed: 2018-05-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Package Structure Having a Multi-Thermal Interface Material Structure