Patent Assignment
Reel/Frame 046222/0534
Assignment of Assignor's Interest
Recorded: 2018-06-28
Pages: 6
Assignors
CHANG, MAO-YEN
Executed: 2018-01-16
TSAI, HAO-YI
Executed: 2018-01-30
PAN, KUO-LUNG
Executed: 2018-01-16
KUO, TIN-HAO
Executed: 2018-01-30
LEE, TZUNG-HUI
Executed: 2018-01-16
LO, TENG-YUAN
Executed: 2018-01-16
TING, HAO-CHUN
Executed: 2018-04-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Semiconductor Packages and Methods of Forming the Same