Patent Assignment
Reel/Frame 046242/0044
Assignment of Assignor's Interest
Recorded: 2018-06-29
Pages: 5
Assignor
LEE, DONG-HA
Executed: 2018-06-15
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Seminconductor Package of Package-on-Package Type